Precision Ceramics Industry

However, ceramic substrate defects manifest in diverse and microscopic forms, making them highly prone to missed detection by the human eye; some defects even require microscopes or profilometers for identification. Specifically, crack defects—particularly subtle micro-cracks—are notoriously difficult to detect, placing extreme demands on inspection precision that traditional vision equipment struggles to meet.

Addressing this challenge, the project deployed Hanchine's AI-based Ceramic Substrate Appearance Defect Inspection Machine. Utilizing line-scan cameras for high-definition imaging and powered by a deep learning intelligent inspection model trained on massive defect datasets, the equipment efficiently and stably detects required defects. In practical operation, it achieves a 0% miss rate​ and an extremely low false alarm rate, perfectly satisfying the client's demand for high-precision quality inspection upgrades compared to traditional equipment.

However, the project encountered two core challenges: the warpage deformation of ceramic substrates is extremely subtle, demanding high precision, while the client's massive production volume required extremely high processing speeds from the online inspection equipment, alongside the challenge of maintaining consistency and repeatability across different inspection stations.

Addressing these issues, the project deployed Hanchine's 3D vision-based ceramic substrate warpage inspection equipment. Combining line laser cameras with semiconductor-grade high-precision linear motors, the equipment ensures consistency and repeatability in warpage measurement, achieving an overall machine flatness repeatability of 0.01 mm​ to meet strict accuracy requirements. Simultaneously, utilizing a specially designed transmission mechanism and a concurrent 5-piece inspection mode, the system increased inspection efficiency to 100 pcs/minute, perfectly resolving the dual contradiction between speed and repeatability in online warpage inspection.

However, the project faced severe challenges: with numerous size ranks and extremely stringent precision requirements, any sorting error could lead to irreversible losses in downstream cutting processes; while traditional contact measurement suffered from slow speed and high maintenance costs, replacing it with visual inspection imposed dual demands of high precision and high speed.

Addressing these pain points, the project deployed Hanchine's Dimension Measurement, Sorting, and Packaging Equipment. This system utilizes a multi-camera vision system stabilized by a mature platform for multi-camera coordinate calibration, ensuring measurement stability and reliable grading data. Furthermore, it innovatively adopts a three-dimensional packaging format to neatly pack sorted substrates into boxes, achieving full-process data traceability and smooth workflow integration, effectively resolving the real-world dilemma of labor-intensive post-process measurement, grading, and packaging.